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1 Ergebnisse
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Doping-selective etching of silicon for wafer thinning in t..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Venkataraman, Nandini
;
Risse, Benedikt
;
Decierdo, Gregorio
... - p. 1524-1530 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00259
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Doping-selective etching of silicon for wafer thinning in the fabrication of backside-illuminated stacked CMOS image sensors</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195401&Exemplar=1&LAN=DE A1 Venkataraman, Nandini A1 Risse, Benedikt A1 Decierdo, Gregorio A1 Singh, Navab A1 Senthilkumar, Darshini A1 Kandasamy, Deepthi A1 Toh, Eng Huat A1 Lim, Louis YR 2023 SN 2377-5726 K1 Fabrication K1 Three-dimensional displays K1 CMOS image sensors K1 Silicon K1 Surface roughness K1 Etching K1 Rough surfaces K1 backside illuminated CMOS image sensors K1 silicon wafer thinning K1 isotropic silicon etching K1 HNA etching SP 1524 OP 1530 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00259 DO https://doi.org/10.1109/ECTC51909.2023.00259 SF ELIB - SuUB Bremen
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