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1 Ergebnisse
1
High Modulus Photosensitive Permanent Film Utilizing Novel ..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Yamagata, Ken-ichi
;
Yuge, Shiori
;
Nakamura, Ryosuke
. - p. 40-43 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00015
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>High Modulus Photosensitive Permanent Film Utilizing Novel Polymerization System for Advanced MEMS Structure Fabrication</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195404&Exemplar=1&LAN=DE A1 Yamagata, Ken-ichi A1 Yuge, Shiori A1 Nakamura, Ryosuke A1 Imai, Hirofumi YR 2023 SN 2377-5726 K1 Micromechanical devices K1 Radio frequency K1 Temperature K1 Loading K1 Resists K1 Curing K1 Packaging K1 MEMS K1 Organic-inorganic composite K1 Cavity structure K1 Cation-radical hybrid polymerization SP 40 OP 43 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00015 DO https://doi.org/10.1109/ECTC51909.2023.00015 SF ELIB - SuUB Bremen
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