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1 Ergebnisse
1
Selective Self-Assembled Monolayer for Copper Surface Prote..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Rogers, Jack
;
Netzband, Chris
;
Hoshino, Satohiko
... - p. 1694-1697 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00288
RT T1
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
: T1
Selective Self-Assembled Monolayer for Copper Surface Protection During Plasma Activation of Hybrid-Bonded Wafers
UL https://suche.suub.uni-bremen.de/peid=ieee-10195410&Exemplar=1&LAN=DE A1 Rogers, Jack A1 Netzband, Chris A1 Hoshino, Satohiko A1 Antonovich, Nathan A1 Kramer, Vanessa A1 Tuchman, Andrew YR 2023 SN 2377-5726 K1 Wafer bonding K1 Energy measurement K1 Electronic components K1 Electric variables K1 Oxidation K1 Plasmas K1 Dielectrics K1 bonding K1 self-assembled monolayer K1 copper K1 interface SP 1694 OP 1697 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00288 DO https://doi.org/10.1109/ECTC51909.2023.00288 SF ELIB - SuUB Bremen
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