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Packaging of Ultra-dynamic Photonic Switches and Transceive..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),

Van Steenberge, G. ; Roelkens, G. ; Ossieur, P.... - p. 742-747 , 2023

Link: https://doi.org/10.1109/ECTC51909.2023.00129

RT 
T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Packaging of Ultra-dynamic Photonic Switches and Transceivers for Integration into 5G Radio Access Network and Datacenter Sub-systems</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-10195412&Exemplar=1&LAN=DE
				
A1 Van Steenberge, G.
A1 Roelkens, G.
A1 Ossieur, P.
A1 Missinne, J.
A1 Van Asch, J.
A1 Zhang, J.
A1 Qin, S.
A1 Van Campenhout, J.
A1 Van Kerkhof, J.
A1 Milosevic, M. M.
A1 Bakopoulos, P.
A1 Syrivelis, D.
A1 Mentovich, E.
A1 Morozov, K.
A1 Stracca, S.
A1 Bigongiari, A.
A1 Joerg, T.
A1 Schlick, D.
A1 Braun, T.
A1 Wohrmann, M.
A1 Gernhardt, R.
A1 Cheng, Q.
A1 Li, T.
A1 Penty, R.
YR 2023
SN 2377-5726
K1 Optical fibers
K1 Integrated optics
K1 Semiconductor optical amplifiers
K1 Integrated circuits
K1 Stimulated emission
K1 Optical switches
K1 Packaging
K1 scalable
K1 photonic integration and packaging
K1 switch fabric
K1 micro-transfer-printing
K1 FOWLP
K1 optical redistri-bution layer
K1 high-density substrates
SP 742
OP 747
LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00129
DO https://doi.org/10.1109/ECTC51909.2023.00129
SF ELIB - SuUB Bremen

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