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1 Ergebnisse
1
CMOS-Compatible Fine Pitch Al-Al Bonding:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Cheemalamarri, Hemanth Kumar
;
Varghese, Binni
;
Jaibir, Sharma
... - p. 1725-1729 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00294
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>CMOS-Compatible Fine Pitch Al-Al Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195413&Exemplar=1&LAN=DE A1 Cheemalamarri, Hemanth Kumar A1 Varghese, Binni A1 Jaibir, Sharma A1 Hongyu, Li A1 S, Chandra Rao S A1 Singh, Navab A1 Rao, Vempati Srinivasa A1 Chui, King-Jien YR 2023 SN 2377-5726 K1 Micromechanical devices K1 X-ray scattering K1 Aluminum K1 Surface morphology K1 Electronic packaging thermal management K1 Surface roughness K1 Oxidation K1 Fine pitch K1 thermo compression bonding K1 low thermal budget K1 passivation SP 1725 OP 1729 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00294 DO https://doi.org/10.1109/ECTC51909.2023.00294 SF ELIB - SuUB Bremen
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