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Wafer Level Chip Scale Package Technology Applied to MEMS P..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Del Sarto, Marco ; Maggi, Luca ; Chiarillo, Tiziano... - p. 1273-1278 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00217