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Understanding the Influence of Copper Substrate Oxidation o..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Stegmann, Tamira
;
Schwobel, Andre
;
Schmitt, Wolfgang
... - p. 635-642 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00112
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Understanding the Influence of Copper Substrate Oxidation on Silver Pressure Sintering Performance</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195423&Exemplar=1&LAN=DE A1 Stegmann, Tamira A1 Schwobel, Andre A1 Schmitt, Wolfgang A1 Gunst, Stefan A1 Durst, Karsten A1 Klar, Peter A1 Neugebauer, Nils A1 Dornseifer, Jan Luka YR 2023 SN 2377-5726 K1 Silver K1 Spectroscopy K1 Sintering K1 Atmosphere K1 Oxidation K1 Power electronics K1 Copper K1 pressure sintering K1 copper oxide K1 interdiffusion SP 635 OP 642 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00112 DO https://doi.org/10.1109/ECTC51909.2023.00112 SF ELIB - SuUB Bremen
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