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1
A Predictive Metallographic Means to Identify The Relative ..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Bernhard, Tobias
;
Massey, Roger
;
Klaeden, Kilian
... - p. 331-335 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00062
RT T1
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
: T1
A Predictive Metallographic Means to Identify The Relative Risk of Failure for Plated Micro Vias
UL https://suche.suub.uni-bremen.de/peid=ieee-10195425&Exemplar=1&LAN=DE A1 Bernhard, Tobias A1 Massey, Roger A1 Klaeden, Kilian A1 Zarwell, Sebastian A1 Kempa, Stefan A1 Steinhaeuser, Edith A1 Dieter, Sascha A1 Bruening, Frank YR 2023 SN 2377-5726 K1 Industries K1 Electric potential K1 Electronic components K1 Reliability engineering K1 Product design K1 Epitaxial growth K1 Microstructure K1 stacked BMV K1 reliability K1 epitaxial interfaces K1 crystallization K1 microstructure SP 331 OP 335 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00062 DO https://doi.org/10.1109/ECTC51909.2023.00062 SF ELIB - SuUB Bremen
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