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1 Ergebnisse
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Modeling Grain Size Effects on Deformation Behavior of SAC ..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Mondal, Debabrata
;
Suhling, Jeffrey C.
;
Lall, Pradeep
- p. 2062-2069 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00353
RT T1
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
: T1
Modeling Grain Size Effects on Deformation Behavior of SAC Solder Joints
UL https://suche.suub.uni-bremen.de/peid=ieee-10195426&Exemplar=1&LAN=DE A1 Mondal, Debabrata A1 Suhling, Jeffrey C. A1 Lall, Pradeep YR 2023 SN 2377-5726 K1 Grain size K1 Semiconductor device modeling K1 Thermal expansion K1 Deformation K1 Metals K1 Crystalline materials K1 Behavioral sciences K1 crystal plasticity K1 slip systems K1 beta-tin K1 size effects K1 deformation behavior K1 BCT K1 dislocation K1 polycrystalline SP 2062 OP 2069 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00353 DO https://doi.org/10.1109/ECTC51909.2023.00353 SF ELIB - SuUB Bremen
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