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1 Ergebnisse
1
Alignment through thick Si layer for high resolution patter..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Sundaram, Arvind
;
Tew, Chin Khang
;
Tan, Guo Wei
... - p. 1150-1155 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00197
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Alignment through thick Si layer for high resolution patterning on bonded wafers with tight overlay margin using immersion lithography</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195428&Exemplar=1&LAN=DE A1 Sundaram, Arvind A1 Tew, Chin Khang A1 Tan, Guo Wei A1 Fu, Yuan-Hsing A1 Li, Hongyu A1 Venkataraman, Nandini A1 Rao, Bhesetti Chandra A1 Singh, Navab YR 2023 SN 2377-5726 K1 Semiconductor device measurement K1 Lithography K1 Stacking K1 Measurement uncertainty K1 Multichip modules K1 Metals K1 Semiconductor device manufacture K1 Bonded wafer K1 Alignment K1 Through Silicon Via K1 Tight overlay SP 1150 OP 1155 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00197 DO https://doi.org/10.1109/ECTC51909.2023.00197 SF ELIB - SuUB Bremen
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