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1 Ergebnisse
1
Fine Pitch Die-to-Wafer Hybrid Bonding:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Mirkarimi, Laura
;
Workman, Thomas
;
Theil, Jeremy
... - p. 83-90 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00023
RT T1
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
: T1
Fine Pitch Die-to-Wafer Hybrid Bonding
UL https://suche.suub.uni-bremen.de/peid=ieee-10195430&Exemplar=1&LAN=DE A1 Mirkarimi, Laura A1 Workman, Thomas A1 Theil, Jeremy A1 Fountain, Gill A1 Bang, KM A1 Zhao, Oliver A1 Lee, Bongsub A1 Uzoh, Cyprian A1 Suwito, Dominik A1 Gao, Guilian YR 2023 SN 2377-5726 K1 Resistance K1 Optical losses K1 Optical interferometry K1 Three-dimensional displays K1 Microscopy K1 Metals K1 Optical variables measurement K1 low temperature Cu to Cu direct bonding K1 direct bond interconnect (DBI) K1 DBI Ultra K1 hybrid bonding K1 D2W K1 fine pitch K1 via K1 bond alignment K1 die distortion K1 HVM SP 83 OP 90 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00023 DO https://doi.org/10.1109/ECTC51909.2023.00023 SF ELIB - SuUB Bremen
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