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1 Ergebnisse
1
Optimization of Cu interconnects - SiCN interfacial adhesio..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Kim, Dong Jun
;
Kang, Sumin
;
Lee, Sun Woo
... - p. 367-373 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00068
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Optimization of Cu interconnects - SiCN interfacial adhesion by surface treatments</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195431&Exemplar=1&LAN=DE A1 Kim, Dong Jun A1 Kang, Sumin A1 Lee, Sun Woo A1 Lee, Inhwa A1 Park, Seungju A1 Lee, Jihyun A1 Kim, Joong Jung A1 Kim, Taek-Soo YR 2023 SN 2377-5726 K1 Semiconductor device measurement K1 Adhesives K1 Crystals K1 Plasma measurements K1 Silicon K1 Plasmas K1 Structural beams K1 Mechanical reliability K1 Quantitative interfacial adhesion energy K1 Surface treatments K1 Crystal orientations K1 Alternating crack path SP 367 OP 373 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00068 DO https://doi.org/10.1109/ECTC51909.2023.00068 SF ELIB - SuUB Bremen
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