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1 Ergebnisse
1
Patch-type Flex SiP Platform for Heathcare Application:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Chen, Ming-Hung
;
Chang, Wei-Hao
;
Jian, Hui-Ping
... - p. 1438-1441 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00245
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Patch-type Flex SiP Platform for Heathcare Application</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195432&Exemplar=1&LAN=DE A1 Chen, Ming-Hung A1 Chang, Wei-Hao A1 Jian, Hui-Ping A1 Liu, Chao-Wei A1 Wu, Shang-Lin A1 Chou, Yi-Chun A1 Chiang, Sung-Hung A1 Chang, Jun-Kai A1 Pi, Tun-Ching A1 Lee, Wei-Chun A1 Kao, Jen-Chieh A1 Yeh, Yung-I YR 2023 SN 2377-5726 K1 Temperature measurement K1 Flexible printed circuits K1 System-in-package K1 Wearable computers K1 Electrocardiography K1 Bending K1 Watches K1 System-in-Package (SiP) K1 Electrocardiography (EeG) K1 Patch SP 1438 OP 1441 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00245 DO https://doi.org/10.1109/ECTC51909.2023.00245 SF ELIB - SuUB Bremen
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