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1 Ergebnisse
1
Design and Analysis of 3D Heterogeneous Chiplet Stack for R..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Rotaru, Mihai Dragos
;
Tiwari, Shashank
;
Castillou, Paul
.. - p. 1486-1492 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00252
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Design and Analysis of 3D Heterogeneous Chiplet Stack for RF Front-End Module Minituarization</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195439&Exemplar=1&LAN=DE A1 Rotaru, Mihai Dragos A1 Tiwari, Shashank A1 Castillou, Paul A1 Chong, Chai Tai A1 Jien, Chui King YR 2023 SN 2377-5726 K1 Radio frequency K1 Semiconductor device modeling K1 Three-dimensional displays K1 Integrated circuit interconnections K1 Insertion loss K1 Loss measurement K1 Frequency measurement K1 RDL K1 SiP K1 RF Front End K1 heterogenous integration K1 SOI K1 TSV SP 1486 OP 1492 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00252 DO https://doi.org/10.1109/ECTC51909.2023.00252 SF ELIB - SuUB Bremen
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