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1 Ergebnisse
1
Micro Transfer Printing Various Thickness Components Direct..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Oswalt, Kevin
;
Ramaswamy, Prasanna
;
Fecioru, Alin
... - p. 157-160 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00035
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Micro Transfer Printing Various Thickness Components Directly from Dicing Tape</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195441&Exemplar=1&LAN=DE A1 Oswalt, Kevin A1 Ramaswamy, Prasanna A1 Fecioru, Alin A1 Lakshmanan, Ramji A1 Gautam, Devendraprakash A1 Stenson, Bernard A1 Moore, Tanya A1 Gomez, David YR 2023 SN 2377-5726 K1 Printing K1 Millimeter wave devices K1 Electronic components K1 Packaging K1 Silicon K1 Etching K1 Substrates K1 micro transfer printing K1 heterogeneous integration SP 157 OP 160 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00035 DO https://doi.org/10.1109/ECTC51909.2023.00035 SF ELIB - SuUB Bremen
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