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Investigation of Acceleration factors for SnAgCu-Bi Solder ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Jeon, Choongpyo ; Choi, Youngsung ; Jeong, Hyunsik... - p. 846-851 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00146