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Next Generation Infrared (IR) Laser Debonding / Silicon Han..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),

Chen, Qianwen ; Belyansky, Michael ; Sulehria, Yasir... - p. 1175-1180 , 2023

Link: https://doi.org/10.1109/ECTC51909.2023.00201

RT 
T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-10195447&Exemplar=1&LAN=DE
				
A1 Chen, Qianwen
A1 Belyansky, Michael
A1 Sulehria, Yasir
A1 Horibe, Akihiro
A1 Qin, Liqiao
A1 Pujari, Ruturaj
A1 Perfecto, Eric
A1 Lie, Fee Li
A1 Butt, Shahid
A1 Polomoff, Nick
A1 Miyazawa, Risa
A1 Kohara, Sayuri
A1 Farooq, Mukta
A1 Hisada, Takashi
A1 Oakley, Jennifer
A1 Skordas, Spyridon
A1 Fan, Susan
A1 Sakuma, Katsuyuki
A1 Knickerbocker, John
A1 Mcherron, Dale
A1 Tamura, Takeshi
A1 Ishii, Takayuki
A1 Jaipan, Panupong
A1 Nishimura, Satoshi
A1 Son, Ilseok
A1 Maeda, Yohei
A1 Koga, Takashi
A1 Klein, Joseph
A1 Tashiro, Kei
A1 Arkalgud, Sitaram
A1 Kondo, Yoshihiro
YR 2023
SN 2377-5726
K1 Laser theory
K1 Measurement by laser beam
K1 Silicon
K1 Chemical lasers
K1 Laser ablation
K1 Laser beams
K1 Bonding
K1 Silicon (Si) handler
K1 Infrared (IR) laser
K1 wafer debonding
K1 chiplet
K1 heterogeneous integration
SP 1175
OP 1180
LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00201
DO https://doi.org/10.1109/ECTC51909.2023.00201
SF ELIB - SuUB Bremen

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