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1 Ergebnisse
1
Enhancement of Thermal Transient Prediction Accuracy for Mo..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Park, Hwanjoo
;
Kim, Taehwan
;
Kang, Sunggu
... - p. 1339-1343 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00228
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Enhancement of Thermal Transient Prediction Accuracy for Mobile AP Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195452&Exemplar=1&LAN=DE A1 Park, Hwanjoo A1 Kim, Taehwan A1 Kang, Sunggu A1 Lee, Jonggyu A1 Mun, Sungho A1 Kim, Jaechoon A1 Jung, Hangi A1 Kim, Dongwook YR 2023 SN 2377-5726 K1 Time-frequency analysis K1 Metals K1 Machine learning K1 Predictive models K1 Electronic packaging thermal management K1 Thermal management K1 Thermal conductivity K1 Mobile AP K1 Thermal Transient K1 AP Performance K1 Fan-out Package SP 1339 OP 1343 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00228 DO https://doi.org/10.1109/ECTC51909.2023.00228 SF ELIB - SuUB Bremen
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