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1 Ergebnisse
1
Novel Low Dk/Df Photoimageable Dielectric for Redistributio..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Zapico, Guillermo Fernandez
;
Kawauchi, Fumihiko
;
Kawashita, Shinya
... - p. 1244-1248 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00212
RT T1
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
: T1
Novel Low Dk/Df Photoimageable Dielectric for Redistribution Layer
UL https://suche.suub.uni-bremen.de/peid=ieee-10195455&Exemplar=1&LAN=DE A1 Zapico, Guillermo Fernandez A1 Kawauchi, Fumihiko A1 Kawashita, Shinya A1 Hirasawa, Manabu A1 Sato, Kitaru A1 Imai, Tetsuya A1 Kondo, Hidekazu A1 Makino, Tatsuya YR 2023 SN 2377-5726 K1 Solvents K1 Temperature K1 Thermomechanical processes K1 Polyimides K1 Packaging K1 Propagation losses K1 Behavioral sciences K1 advanced packaging K1 dielectric properties K1 Dk/Df K1 redistribution layer SP 1244 OP 1248 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00212 DO https://doi.org/10.1109/ECTC51909.2023.00212 SF ELIB - SuUB Bremen
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