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Process Challenges During CVD Oxide Deposition on the Backs..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),

Kennes, Koen ; Guerrero, Alice ; Salahouelhadj, Abdellah... - p. 1584-1589 , 2023

Link: https://doi.org/10.1109/ECTC51909.2023.00269

RT 
T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Process Challenges During CVD Oxide Deposition on the Backside of $20-\mu m$ Thin 300-mm Wafers Temporarily Bonded to Glass Carriers</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-10195458&Exemplar=1&LAN=DE
				
A1 Kennes, Koen
A1 Guerrero, Alice
A1 Salahouelhadj, Abdellah
A1 Suhard, Samuel
A1 Derakhshandeh, Jaber
A1 Phommahaxay, Alain
A1 Brems, Steven
A1 Beyer, Gerald
A1 Beyne, Eric
YR 2023
SN 2377-5726
K1 Semiconductor device modeling
K1 Temperature dependence
K1 Deformation
K1 Electronic components
K1 Glass
K1 Temperature control
K1 Finite element analysis
K1 Heterogeneous integration
K1 wafer bonder
K1 dielectric bonding
K1 hybrid bonding
K1 temporary bonding material
K1 laser release material
K1 laser debonding
K1 CVD oxide
K1 thin wafer processing
K1 temporary carrier
SP 1584
OP 1589
LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00269
DO https://doi.org/10.1109/ECTC51909.2023.00269
SF ELIB - SuUB Bremen

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