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1 Ergebnisse
1
Process Challenges During CVD Oxide Deposition on the Backs..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Kennes, Koen
;
Guerrero, Alice
;
Salahouelhadj, Abdellah
... - p. 1584-1589 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00269
RT T1
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
: T1
Process Challenges During CVD Oxide Deposition on the Backside of $20-\mu m$ Thin 300-mm Wafers Temporarily Bonded to Glass Carriers
UL https://suche.suub.uni-bremen.de/peid=ieee-10195458&Exemplar=1&LAN=DE A1 Kennes, Koen A1 Guerrero, Alice A1 Salahouelhadj, Abdellah A1 Suhard, Samuel A1 Derakhshandeh, Jaber A1 Phommahaxay, Alain A1 Brems, Steven A1 Beyer, Gerald A1 Beyne, Eric YR 2023 SN 2377-5726 K1 Semiconductor device modeling K1 Temperature dependence K1 Deformation K1 Electronic components K1 Glass K1 Temperature control K1 Finite element analysis K1 Heterogeneous integration K1 wafer bonder K1 dielectric bonding K1 hybrid bonding K1 temporary bonding material K1 laser release material K1 laser debonding K1 CVD oxide K1 thin wafer processing K1 temporary carrier SP 1584 OP 1589 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00269 DO https://doi.org/10.1109/ECTC51909.2023.00269 SF ELIB - SuUB Bremen
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