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Liquid Compression Mold Underfill Optimization with Low War..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kamimura, Tsuyoshi ; Shigeno, Yuto ; Sato, Shinichi. - p. 1226-1230 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00209