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1 Ergebnisse
1
Novel IR Laser Cleaving for ultra-thin Layer Transfer and 3..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Uhrmann, Thomas
;
Urban, Peter
;
Povazay, Boris
... - p. 1749-1753 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00299
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Novel IR Laser Cleaving for ultra-thin Layer Transfer and 3D Stacked Devices</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195462&Exemplar=1&LAN=DE A1 Uhrmann, Thomas A1 Urban, Peter A1 Povazay, Boris A1 Gruber, Michael J. A1 Bavin, Julian A1 Burgstaller, Daniel A1 Wimplinger, Markus A1 Thallner, Bernd YR 2023 SN 2377-5726 K1 Wafer bonding K1 Three-dimensional displays K1 Stacking K1 Random access memory K1 Glass K1 Silicon K1 Laser fusion K1 IR laser release K1 Nanocleave K1 fusion bonding K1 hybrid bonding K1 W2W bonding K1 D2W hybrid bonding K1 debonding SP 1749 OP 1753 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00299 DO https://doi.org/10.1109/ECTC51909.2023.00299 SF ELIB - SuUB Bremen
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