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1 Ergebnisse
1
Warpage Modulation Study on Panel-level Compression Molding..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
He, Liang
;
Xie, Zhixin
;
Deshpande, Shishir
... - p. 526-530 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00094
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Warpage Modulation Study on Panel-level Compression Molding Technology for Heterogenous Integration Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195466&Exemplar=1&LAN=DE A1 He, Liang A1 Xie, Zhixin A1 Deshpande, Shishir A1 Jimenez, Andrew A1 Han, Jung Kyu A1 Duan, Gang A1 Manepalli, Rahul YR 2023 SN 2377-5726 K1 Bridges K1 Stability criteria K1 Process control K1 Computer architecture K1 Power system stability K1 Routing K1 Silicon K1 Heterogeneous chiplet integration K1 Warpage reduction K1 Compression molding SP 526 OP 530 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00094 DO https://doi.org/10.1109/ECTC51909.2023.00094 SF ELIB - SuUB Bremen
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