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1 Ergebnisse
1
Ultra-Fine Pitch RDL (UFPRDL) using Polymer Dual Damascene ..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Pinho, Nelson
;
Chery, Emmanuel
;
Pantano, Nicolas
... - p. 1364-1368 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00233
RT T1
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
: T1
Ultra-Fine Pitch RDL (UFPRDL) using Polymer Dual Damascene processing
UL https://suche.suub.uni-bremen.de/peid=ieee-10195468&Exemplar=1&LAN=DE A1 Pinho, Nelson A1 Chery, Emmanuel A1 Pantano, Nicolas A1 Slabbekoorn, John A1 Miller, Andy A1 Beyne, Eric YR 2023 SN 2377-5726 K1 Three-dimensional displays K1 Metallization K1 Kelvin K1 Linearity K1 Electronic components K1 Bandwidth K1 Packaging K1 3D packaging K1 Redistribution layers (RDL) K1 Reliability K1 Adhesion K1 Fine Pitch RDL K1 Photosensitive Polymer K1 damascene SP 1364 OP 1368 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00233 DO https://doi.org/10.1109/ECTC51909.2023.00233 SF ELIB - SuUB Bremen
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