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1 Ergebnisse
1
Effect of Ceramic Filler in Epoxy Mold Compound on Thermome..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Noh, Taejoon
;
Jeong, Haksan
;
Jung, Seung-boo
- p. 2029-2033 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00348
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Effect of Ceramic Filler in Epoxy Mold Compound on Thermomechanical Property of FOWLP</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195481&Exemplar=1&LAN=DE A1 Noh, Taejoon A1 Jeong, Haksan A1 Jung, Seung-boo YR 2023 SN 2377-5726 K1 Thermomechanical processes K1 Conductivity K1 Electronic packaging thermal management K1 Electromagnetic compatibility K1 Thermal conductivity K1 Ceramics K1 Compounds K1 Ceramic filler K1 Epoxy mold compound K1 Fan-out package K1 Junction temperature component K1 Warpage SP 2029 OP 2033 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00348 DO https://doi.org/10.1109/ECTC51909.2023.00348 SF ELIB - SuUB Bremen
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