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Fine-Pitch $30\ \mu \mathrm{m}$ Cu-Cu Bonding using Electro..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Lin, Yung-Sheng ; Chiang, Chun-Wei ; Hung, Yun-Ching... - p. 1115-1118 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00191