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1 Ergebnisse
1
Reflow Oven Zone Temperature Advisor using the AI-Driven Sm..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Lai, Yangyang
;
Yin, Pengcheng
;
Yang, Junbo
... - p. 1773-1778 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00303
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Reflow Oven Zone Temperature Advisor using the AI-Driven Smart Recipe Generator</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195489&Exemplar=1&LAN=DE A1 Lai, Yangyang A1 Yin, Pengcheng A1 Yang, Junbo A1 Ha, Jonghwan A1 Deo, Karthik A A1 Park, Seungbae YR 2023 SN 2377-5726 K1 Semiconductor device modeling K1 Temperature measurement K1 Heating systems K1 Ovens K1 Machine learning K1 Predictive models K1 Generators K1 machine learning K1 computational fluid dynamics K1 reflow soldering K1 gaussian process regression SP 1773 OP 1778 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00303 DO https://doi.org/10.1109/ECTC51909.2023.00303 SF ELIB - SuUB Bremen
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