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1 Ergebnisse
1
Fine Pitch Micro Via Interconnection with Reliable Electrol..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Hsieh, Ming-Chun
;
Zhang, Zheng
;
Nishijima, Masahiko
... - p. 1381-1384 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00236
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Fine Pitch Micro Via Interconnection with Reliable Electroless/electric Cu plating Layers Combined with High Power DUV Picosecond Laser for Organic Substrates</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195491&Exemplar=1&LAN=DE A1 Hsieh, Ming-Chun A1 Zhang, Zheng A1 Nishijima, Masahiko A1 Suetake, Aiji A1 Chen, Chuantong A1 Yoshida, Hiroyoshi A1 Li, Wangyun A1 Okumura, Rieko A1 Homma, Hidekazu A1 Kita, Koji A1 Okada, George A1 Suganuma, Katsuaki YR 2023 SN 2377-5726 K1 Drilling K1 Micrometers K1 Power lasers K1 Plating K1 Nickel K1 Manufacturing K1 Reliability K1 micro via K1 fine pitch K1 electroless copper plating K1 reliability SP 1381 OP 1384 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00236 DO https://doi.org/10.1109/ECTC51909.2023.00236 SF ELIB - SuUB Bremen
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