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Low-stress TSVs for high-density 3D integration:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Qiao, Jingping ; Jiao, Binbin ; Jia, Shiqi... - p. 606-611 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00107