I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Characterizations of Indium Interconnects for 3D Quantum As..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Feautrier, Celine
;
Deschaseaux, Edouard
;
Gueugnot, Alain
... - p. 973-979 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00166
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Characterizations of Indium Interconnects for 3D Quantum Assemblies</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195499&Exemplar=1&LAN=DE A1 Feautrier, Celine A1 Deschaseaux, Edouard A1 Gueugnot, Alain A1 Charbonnier, Jean A1 Plihon, Aurelia A1 Dupre, Ludovic A1 Henry, Franck A1 Berger, Frederic A1 Pagot, Antoine A1 Renet, Sebastien A1 Mailliart, Olivier A1 Thomas, Candice YR 2023 SN 2377-5726 K1 Thermal expansion K1 Semiconductor device measurement K1 Three-dimensional displays K1 Gallium arsenide K1 Thermal conductivity K1 Silicon K1 Robustness K1 cryo-packaging K1 quantum computation K1 indium microbumps K1 intermetallic compound SP 973 OP 979 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00166 DO https://doi.org/10.1109/ECTC51909.2023.00166 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
