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1 Ergebnisse
1
Lithographic Performance and Insulation Reliability of a No..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Inoue, Go
;
Yukimori, Daiki
;
Shibasaki, Kaho
... - p. 44-48 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00016
RT T1
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
: T1
Lithographic Performance and Insulation Reliability of a Novel i-Line Photosensitive Dielectric Material
UL https://suche.suub.uni-bremen.de/peid=ieee-10195503&Exemplar=1&LAN=DE A1 Inoue, Go A1 Yukimori, Daiki A1 Shibasaki, Kaho A1 Okuda, Ayano A1 Ishikawa, Nobuhiro A1 Han, Young-Gun A1 Kanayama, Taka A1 Suetsugu, Tadashi A1 Ogata, Toshiyuki YR 2023 SN 2377-5726 K1 Resistance K1 Insulation K1 Micrometers K1 Dielectric materials K1 Electronic components K1 Materials reliability K1 Life estimation K1 fine-pitch RDLs K1 negative-tone K1 photosensitive dielectric material K1 DOF simulation K1 insulation reliability SP 44 OP 48 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00016 DO https://doi.org/10.1109/ECTC51909.2023.00016 SF ELIB - SuUB Bremen
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