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A novel FOWLP method to integrate delicate MEMS components:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Woehrmann, Markus ; Dreissigacker, Marc ; Braun, Tanja.. - p. 1279-1284 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00218