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1 Ergebnisse
1
High reliability design Ag sinter joining on softened Ni-P ..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Chen, Chuantong
;
Liu, Yang
;
Li, Wangyun
... - p. 651-655 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00114
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>High reliability design Ag sinter joining on softened Ni-P /Pt/Ag metallization substrate during harsh thermal cycling</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195524&Exemplar=1&LAN=DE A1 Chen, Chuantong A1 Liu, Yang A1 Li, Wangyun A1 Huo, Fupeng A1 Ueshima, Minoru A1 Sakamoto, Takehsi A1 Oda, Yukinori A1 Suganuma, Katsuaki YR 2023 SN 2377-5726 K1 Deformation K1 Metallization K1 Thermal shock K1 Plating K1 Phosphorus K1 Reliability engineering K1 Bonding K1 Ag-sinter joint K1 Coating technology K1 Thermal shock test K1 Deformation-resistant K1 Interface evolution SP 651 OP 655 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00114 DO https://doi.org/10.1109/ECTC51909.2023.00114 SF ELIB - SuUB Bremen
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