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1 Ergebnisse
1
Aggressive Pitch Scaling (sub-0.5 μm) of W2W Hybrid Bonding..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Sherwood, Tyler
;
Patlolla, Raghuveer
;
Salfelder, Joe
... - p. 13-18 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00010
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Aggressive Pitch Scaling (sub-0.5 μm) of W2W Hybrid Bonding Through Process Innovations</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195528&Exemplar=1&LAN=DE A1 Sherwood, Tyler A1 Patlolla, Raghuveer A1 Salfelder, Joe A1 Kasbauer, Thomas A1 Sreenivasan, Raghav A1 Li, Kun A1 Ley, Ryan A1 Probst, Gernot A1 Appell, Jason A1 Ahn, Ki Cheol A1 Gorchichko, Masha A1 Uhrmann, Thomas YR 2023 SN 2377-5726 K1 Technological innovation K1 Three-dimensional displays K1 Process control K1 Packaging K1 Dielectrics K1 Copper K1 Transistors K1 Hybrid bonding K1 pitch scaling K1 3D packaging K1 CMP K1 recess control K1 bond overlay K1 bond interface SP 13 OP 18 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00010 DO https://doi.org/10.1109/ECTC51909.2023.00010 SF ELIB - SuUB Bremen
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