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1 Ergebnisse
1
A Method to Improve 3D Interconnections Resource Utilizatio..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Li, Ang
;
Jiang, Jianfei
;
Wang, Qin
... - p. 2131-2136 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00366
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Method to Improve 3D Interconnections Resource Utilization and Reliability in Hybrid Bonding Process Considering the Effects on Signal Integrity</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195535&Exemplar=1&LAN=DE A1 Li, Ang A1 Jiang, Jianfei A1 Wang, Qin A1 Jing, Naifeng A1 Dong, Zizheng A1 Ji, Shuya A1 Cheng, Xiulan A1 Zhao, Yuhang YR 2023 SN 2377-5726 K1 Three-dimensional displays K1 Program processors K1 Stacking K1 Routing K1 Reliability engineering K1 Robustness K1 Resource management K1 processor-memory stacking K1 hybrid bonding K1 insertion loss K1 far-end crosstalk K1 eye diagram K1 signal integrity SP 2131 OP 2136 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00366 DO https://doi.org/10.1109/ECTC51909.2023.00366 SF ELIB - SuUB Bremen
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