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1 Ergebnisse
1
Thermal and Mechanical characterization of embedded PTCQ pa..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Weis, Gerald
;
Schwarz, Timo
;
Cherman, Vladimir
.. - p. 537-541 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00096
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Thermal and Mechanical characterization of embedded PTCQ packaging test chip die</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195539&Exemplar=1&LAN=DE A1 Weis, Gerald A1 Schwarz, Timo A1 Cherman, Vladimir A1 Stahr, Hannes A1 Van Der Plas, Geert YR 2023 SN 2377-5726 K1 Multichip modules K1 Electronic components K1 Electronic packaging thermal management K1 Substrates K1 Standards K1 Optimization K1 embedding of semiconductors K1 miniaturization K1 chip-package interaction - CPI K1 thermal performance K1 hiding dies K1 package optimization SP 537 OP 541 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00096 DO https://doi.org/10.1109/ECTC51909.2023.00096 SF ELIB - SuUB Bremen
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