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1
Influence of Microscale Tin Particles on Mechanical Propert..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Hadeler, Steffen
;
Long, Yangyang
;
Ottermann, Rico
... - p. 676-681 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00118
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Influence of Microscale Tin Particles on Mechanical Properties of Silver Sintering Joints with Reduced Processing Parameters</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195544&Exemplar=1&LAN=DE A1 Hadeler, Steffen A1 Long, Yangyang A1 Ottermann, Rico A1 Dencker, Folke A1 Twiefel, Jens A1 Wurz, Marc Christopher YR 2023 SN 2377-5726 K1 Silver K1 Spectroscopy K1 Sintering K1 Electronic components K1 Tin K1 Alloying K1 Mechanical factors K1 silver sintering K1 TLP K1 AgSn K1 shear strength SP 676 OP 681 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00118 DO https://doi.org/10.1109/ECTC51909.2023.00118 SF ELIB - SuUB Bremen
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