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Development of Fine Pitch Backside Redistribution Layer (BR..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Lee, Hyunju ; Park, Sung Keun ; Jeong, Kwangok... - p. 515-519 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00092