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1 Ergebnisse
1
Development of Fine Pitch Backside Redistribution Layer (BR..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Lee, Hyunju
;
Park, Sung Keun
;
Jeong, Kwangok
... - p. 515-519 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00092
RT T1
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
: T1
Development of Fine Pitch Backside Redistribution Layer (BRDL) Process in Fan Out Panel Level Packaging (FOPLP)
UL https://suche.suub.uni-bremen.de/peid=ieee-10195549&Exemplar=1&LAN=DE A1 Lee, Hyunju A1 Park, Sung Keun A1 Jeong, Kwangok A1 Jung, Jaemok A1 Choi, Ju-il A1 Kang, Un-Byoung A1 Kim, Kuyoung YR 2023 SN 2377-5726 K1 Fabrication K1 Fans K1 Wet etching K1 Annealing K1 Adhesives K1 Lithography K1 Metals K1 Packaging K1 FOPLP K1 BRDL K1 Fine Pitch SP 515 OP 519 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00092 DO https://doi.org/10.1109/ECTC51909.2023.00092 SF ELIB - SuUB Bremen
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