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1 Ergebnisse
1
Intelligent Multi-Physics Design of 3-D Leadframe- based Si..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Torres-Surillo, Emanuel
;
Molina-Mangual, Christian
;
Smet, Vanessa
- p. 1952-1958 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00335
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Intelligent Multi-Physics Design of 3-D Leadframe- based SiC Power Module with Die Stacking for Transportation Electrification</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195556&Exemplar=1&LAN=DE A1 Torres-Surillo, Emanuel A1 Molina-Mangual, Christian A1 Smet, Vanessa YR 2023 SN 2377-5726 K1 Power system measurements K1 Silicon carbide K1 Density measurement K1 Stacking K1 Layout K1 Multichip modules K1 Computer architecture K1 Silicon-carbide traction inverter K1 electric vehicles K1 3D package architectures K1 die stacking K1 machine- learning optimization SP 1952 OP 1958 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00335 DO https://doi.org/10.1109/ECTC51909.2023.00335 SF ELIB - SuUB Bremen
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