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1 Ergebnisse
1
Development of PMUT Array Packaging from Characterisation P..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Giusti, Dominico
;
Gritti, Alex
;
Quaglia, Fabio
... - p. 1442-1449 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00246
RT T1
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
: T1
Development of PMUT Array Packaging from Characterisation Prototypes to Customer Samples
UL https://suche.suub.uni-bremen.de/peid=ieee-10195558&Exemplar=1&LAN=DE A1 Giusti, Dominico A1 Gritti, Alex A1 Quaglia, Fabio A1 Savoia, Alessandro Stuart A1 Sandoh, Hideyuki A1 Klug, Gerald A1 Hoshino, Hitoshi A1 Rahul, Dutta A1 Rao, Vempati Srinivasa A1 Wee, David Ho Soon A1 Wakahara, Masatoshi A1 Shaw, Mark YR 2023 SN 2377-5726 K1 Ultrasonic transducers K1 Ultrasonic imaging K1 Image resolution K1 Prototypes K1 Ultrasonic transducer arrays K1 Electronic components K1 Packaging K1 MEMS K1 PMUT K1 FOWLP SP 1442 OP 1449 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00246 DO https://doi.org/10.1109/ECTC51909.2023.00246 SF ELIB - SuUB Bremen
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