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Reliability and Failure Analysis of Chip-to-Substrate Cu-Pi..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Sosa, Ramon A. ; Antoniou, Antonia ; Smet, Vanessa - p. 318-323 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00060