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A Heterogeneously Integrated Wafer-level Processed Co-Packa..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),

Nair Gourikutty, Sajay Bhuvanendran ; Long, Lau Boon ; Wei, Seit Wen... - p. 207-211 , 2023

Link: https://doi.org/10.1109/ECTC51909.2023.00043

RT 
T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-10195567&Exemplar=1&LAN=DE
				
A1 Nair Gourikutty, Sajay Bhuvanendran
A1 Long, Lau Boon
A1 Wei, Seit Wen
A1 Jong, Ming Chinq
A1 Wee Ho, David Soon
A1 Wu, Jiaqi
A1 Lim, Teck Guan
A1 Mandal, Rathin
A1 Choong, Chong Ser
A1 Yee, Chia Lai
A1 Li, Xin
A1 Liow, Jason Tsung-Yang
A1 Bhattacharya, Surya
YR 2023
SN 2377-5726
K1 Integrated optics
K1 Data centers
K1 Packaging
K1 Optical coupling
K1 Transceivers
K1 Wafer scale integration
K1 Engines
K1 Hyperscale Data Centers
K1 High-performance computing
K1 Electronic Photonic Package
K1 Silicon photonics
K1 Heterogeneous Integration
K1 Optical Transceivers
K1 Optical Engine
K1 Fan-out wafer-level packaging
SP 207
OP 211
LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00043
DO https://doi.org/10.1109/ECTC51909.2023.00043
SF ELIB - SuUB Bremen

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