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1 Ergebnisse
1
Low-Temperature and Pressureless Cu-to-Cu Bonding by Electr..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Shih, Po-Shao
;
Huang, Jeng-Hau
;
Shen, Chang-Hsien
... - p. 579-584 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00102
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Low-Temperature and Pressureless Cu-to-Cu Bonding by Electroless Pd Plating using Microfluidic System</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195568&Exemplar=1&LAN=DE A1 Shih, Po-Shao A1 Huang, Jeng-Hau A1 Shen, Chang-Hsien A1 Lin, Yu-Chun A1 Grufner, Simon Johannes A1 Renganathan, Vengudusamy A1 Kao, Chin-Li A1 Lin, Yung-Sheng A1 Hung, Yun-Ching A1 Chiang, Chun-Wei A1 Kao, C. Robert YR 2023 SN 2377-5726 K1 Electric potential K1 Three-dimensional displays K1 Plating K1 Skin K1 Epitaxial growth K1 Bonding K1 Soldering K1 3D integration K1 Electroless plating K1 Microfluidic system K1 Pressure free bonding K1 low-temperature bonding SP 579 OP 584 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00102 DO https://doi.org/10.1109/ECTC51909.2023.00102 SF ELIB - SuUB Bremen
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