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1 Ergebnisse
1
Reliability Challenges and Mitigation Measures of Small Bod..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Su, Peng
;
Ahmed, Omar
;
Ahari, Arman
.. - p. 834-839 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00144
RT T1
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
: T1
Reliability Challenges and Mitigation Measures of Small Body-Sized Components on Complex and High-Layer Count PCBs
UL https://suche.suub.uni-bremen.de/peid=ieee-10195569&Exemplar=1&LAN=DE A1 Su, Peng A1 Ahmed, Omar A1 Ahari, Arman A1 Hutchinson, Leif A1 Glasauer, Bernard YR 2023 SN 2377-5726 K1 Layout K1 Printed circuits K1 Product design K1 Pins K1 Reliability K1 Risk management K1 Soldering K1 board-level reliability K1 solder joints K1 fatigue life K1 finite element analysis K1 QFN K1 FBGA SP 834 OP 839 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00144 DO https://doi.org/10.1109/ECTC51909.2023.00144 SF ELIB - SuUB Bremen
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