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1 Ergebnisse
1
Fabrication of Two-types Panel-level Interposers with Fine ..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Minami, Masashi
;
Yamanaka, Daisuke
;
Toba, Masaya
... - p. 520-525 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00093
RT T1
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
: T1
Fabrication of Two-types Panel-level Interposers with Fine Cu Wirings and Outstanding Electrical Reliability
UL https://suche.suub.uni-bremen.de/peid=ieee-10195573&Exemplar=1&LAN=DE A1 Minami, Masashi A1 Yamanaka, Daisuke A1 Toba, Masaya A1 Tsai, Shan Ho A1 Katoh, Sadaaki A1 Mitsukura, Kazuyuki YR 2023 SN 2377-5726 K1 Wiring K1 Fabrication K1 Computers K1 High-speed networks K1 Electronic components K1 Reliability K1 Servers K1 2.xD semiconductor packages K1 panel level interposers K1 fine wirings K1 electrical reliability SP 520 OP 525 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00093 DO https://doi.org/10.1109/ECTC51909.2023.00093 SF ELIB - SuUB Bremen
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