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1 Ergebnisse
1
Inorganic Temporary Direct Bonding for Collective Die to Wa..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Inoue, Fumihiro
;
Teranishi, Shunsuke
;
Iwata, Tomoya
... - p. 556-563 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00099
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Inorganic Temporary Direct Bonding for Collective Die to Wafer Hybrid Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195575&Exemplar=1&LAN=DE A1 Inoue, Fumihiro A1 Teranishi, Shunsuke A1 Iwata, Tomoya A1 Onishi, Koki A1 Yamamoto, Naoko A1 Kawai, Akihito A1 Aoki, Shimpei A1 Hare, Takashi A1 Uedono, Akira YR 2023 SN 2377-5726 K1 Silicon compounds K1 Wafer bonding K1 Temperature measurement K1 Temperature K1 Annealing K1 Sociology K1 Bonding K1 Die-to-Wafer Hybrid Bonding K1 Temporary bonding K1 Collective Die-to-Wafer bonding K1 Reconstructed Die-to-Wafer bonding SP 556 OP 563 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00099 DO https://doi.org/10.1109/ECTC51909.2023.00099 SF ELIB - SuUB Bremen
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