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1 Ergebnisse
1
Improving Warpage Characterization of Large Wafers in Fan-O..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Huber, Saskia
;
Stegmaier, Andreas
;
van Dijk, Marius
... - p. 1332-1338 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00227
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Improving Warpage Characterization of Large Wafers in Fan-Out Packaging Technology</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195582&Exemplar=1&LAN=DE A1 Huber, Saskia A1 Stegmaier, Andreas A1 van Dijk, Marius A1 Nguyen, Nina A1 Holck, Ole A1 Wittler, Olaf A1 Schneider-Ramelow, Martin YR 2023 SN 2377-5726 K1 Semiconductor device modeling K1 Heating systems K1 Production K1 Numerical simulation K1 Size measurement K1 Numerical models K1 Softening K1 FOWLP K1 Warpage measurement K1 numerical simulation K1 3-point support SP 1332 OP 1338 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00227 DO https://doi.org/10.1109/ECTC51909.2023.00227 SF ELIB - SuUB Bremen
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