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1 Ergebnisse
1
Large Wafer GaN on Silicon Reconstitution with Gold-to-Gold..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Kuchhangi, Ankit
;
Ren, Haoxiang
;
Sahoo, Krutikesh
. - p. 1633-1637 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00277
RT T1
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
: T1
Large Wafer GaN on Silicon Reconstitution with Gold-to-Gold Thermocompression Bonding
UL https://suche.suub.uni-bremen.de/peid=ieee-10195583&Exemplar=1&LAN=DE A1 Kuchhangi, Ankit A1 Ren, Haoxiang A1 Sahoo, Krutikesh A1 Iyer, Subramanian S. YR 2023 SN 2377-5726 K1 Radio frequency K1 Thermal factors K1 Planarization K1 Semiconductor lasers K1 Silicon K1 Etching K1 Power electronics K1 III-V reconstitution K1 Large diameter III-V K1 thermocompression bonding SP 1633 OP 1637 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00277 DO https://doi.org/10.1109/ECTC51909.2023.00277 SF ELIB - SuUB Bremen
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