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1 Ergebnisse
1
A Study on the Surface Activation of Cu and Oxide for Hybri..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Hwang, Bohee
;
Kim, Sanwi
;
Lee, Jeonghwan
... - p. 78-82 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00022
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Study on the Surface Activation of Cu and Oxide for Hybrid Bonding Joint Interface</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195593&Exemplar=1&LAN=DE A1 Hwang, Bohee A1 Kim, Sanwi A1 Lee, Jeonghwan A1 Lee, Soohwan A1 Jee, Youngkun A1 Park, Sangcheon A1 Jo, Gyeongjae A1 Kim, Kwangbae A1 Han, Sungjin A1 Kim, Ilhwan A1 Park, Jumyong A1 Jung, Hyunchul A1 Kang, Dongwoo A1 Kang, Un-Byoung YR 2023 SN 2377-5726 K1 Semiconductor device measurement K1 Three-dimensional displays K1 Random access memory K1 Plasma measurements K1 Particle measurements K1 Plasmas K1 Structural beams K1 Hybrid bonding K1 D2W K1 single beam cantilever K1 bonding strength K1 plasma treatment SP 78 OP 82 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00022 DO https://doi.org/10.1109/ECTC51909.2023.00022 SF ELIB - SuUB Bremen
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