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1 Ergebnisse
1
Critical Challenges with Copper Hybrid Bonding for Chip-to-..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Zhou, Wei
;
Kwon, Michael
;
Chiu, Yingta
... - p. 336-341 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00063
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Critical Challenges with Copper Hybrid Bonding for Chip-to-Wafer Memory Stacking</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195607&Exemplar=1&LAN=DE A1 Zhou, Wei A1 Kwon, Michael A1 Chiu, Yingta A1 Guo, Huimin A1 Bhushan, Bharat A1 Street, Bret A1 Parekh, Kunal A1 Singh, Akshay YR 2023 SN 2377-5726 K1 Annealing K1 Planarization K1 Stacking K1 Dielectric materials K1 Memory management K1 Hybrid power systems K1 Plasmas K1 die stacking K1 HBM K1 hybrid bonding K1 interconnection SP 336 OP 341 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00063 DO https://doi.org/10.1109/ECTC51909.2023.00063 SF ELIB - SuUB Bremen
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